Electroless copper deposition and interface characteristics of ionic electroactive polymer

10.1016/j.jmrt.2021.01.062

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Main Authors: Yang, Liang, Zhang, Dongsheng, Zhang, Xining, Tian, Aifen
Other Authors: CIVIL ENGINEERING
Format: Article
Published: Elsevier Editora Ltda 2022
Subjects:
Online Access:https://scholarbank.nus.edu.sg/handle/10635/232504
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-2325042024-04-03T06:40:28Z Electroless copper deposition and interface characteristics of ionic electroactive polymer Yang, Liang Zhang, Dongsheng Zhang, Xining Tian, Aifen CIVIL ENGINEERING Chemical deposition Interface IPMC Weierstrass-Mandelbrot function 10.1016/j.jmrt.2021.01.062 Journal of Materials Research and Technology 11 849-856 2022-10-12T08:08:59Z 2022-10-12T08:08:59Z 2021-03-01 Article Yang, Liang, Zhang, Dongsheng, Zhang, Xining, Tian, Aifen (2021-03-01). Electroless copper deposition and interface characteristics of ionic electroactive polymer. Journal of Materials Research and Technology 11 : 849-856. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jmrt.2021.01.062 2238-7854 https://scholarbank.nus.edu.sg/handle/10635/232504 Attribution-NonCommercial-NoDerivatives 4.0 International https://creativecommons.org/licenses/by-nc-nd/4.0/ Elsevier Editora Ltda Scopus OA2021
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Chemical deposition
Interface
IPMC
Weierstrass-Mandelbrot function
spellingShingle Chemical deposition
Interface
IPMC
Weierstrass-Mandelbrot function
Yang, Liang
Zhang, Dongsheng
Zhang, Xining
Tian, Aifen
Electroless copper deposition and interface characteristics of ionic electroactive polymer
description 10.1016/j.jmrt.2021.01.062
author2 CIVIL ENGINEERING
author_facet CIVIL ENGINEERING
Yang, Liang
Zhang, Dongsheng
Zhang, Xining
Tian, Aifen
format Article
author Yang, Liang
Zhang, Dongsheng
Zhang, Xining
Tian, Aifen
author_sort Yang, Liang
title Electroless copper deposition and interface characteristics of ionic electroactive polymer
title_short Electroless copper deposition and interface characteristics of ionic electroactive polymer
title_full Electroless copper deposition and interface characteristics of ionic electroactive polymer
title_fullStr Electroless copper deposition and interface characteristics of ionic electroactive polymer
title_full_unstemmed Electroless copper deposition and interface characteristics of ionic electroactive polymer
title_sort electroless copper deposition and interface characteristics of ionic electroactive polymer
publisher Elsevier Editora Ltda
publishDate 2022
url https://scholarbank.nus.edu.sg/handle/10635/232504
_version_ 1795374947750641664