DATA-DRIVEN MULTI-SCALE MULTI-PHYSICS MODELLING OF THERMAL STRESS AND DISTORTION IN ADDITIVE MANUFACTURING
Ph.D
Saved in:
Main Author: | CHEN FAN |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2022
|
Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/235758 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Language: | English |
Similar Items
-
High-fidelity modelling of thermal stress for additive manufacturing by linking thermal-fluid and mechanical models
by: Chen, F., et al.
Published: (2021) -
Micro-assembled multi-chamber thermal cycler for low-cost reaction chip thermal multiplexing
by: Zou, Q., et al.
Published: (2014) -
Micro-assembled multi-chamber thermal cycler for low-cost reaction chip thermal multiplexing
by: Zou, Q., et al.
Published: (2013) -
Model for nonlinear thermal effect on pavement warping stresses
by: Zhang, J., et al.
Published: (2014) -
Finite element thermal analysis of a solar photovoltaic module
by: Lee, Y., et al.
Published: (2014)