Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
US6660636
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2012
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sg-nus-scholar.10635-326592015-07-29T07:03:49Z Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating LI, SAM FONG YAU NG, HOU TEE CHEMISTRY THE NATIONAL UNIVERSITY OF SINGAPORE US6660636 Granted Patent 2012-05-02T02:28:28Z 2012-05-02T02:28:28Z 2003-12-09 Patent LI, SAM FONG YAU,NG, HOU TEE (2003-12-09). Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32659 NOT_IN_WOS PatSnap |
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US6660636 |
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CHEMISTRY |
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CHEMISTRY LI, SAM FONG YAU NG, HOU TEE |
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Patent |
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LI, SAM FONG YAU NG, HOU TEE |
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LI, SAM FONG YAU NG, HOU TEE Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
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LI, SAM FONG YAU |
title |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
title_short |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
title_full |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
title_fullStr |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
title_full_unstemmed |
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
title_sort |
highly selective and complete interconnect metal line and via/contact hole filling by electroless plating |
publishDate |
2012 |
url |
http://scholarbank.nus.edu.sg/handle/10635/32659 |
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