Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating

US6660636

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Main Authors: LI, SAM FONG YAU, NG, HOU TEE
Other Authors: CHEMISTRY
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32659
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Institution: National University of Singapore
id sg-nus-scholar.10635-32659
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spelling sg-nus-scholar.10635-326592015-07-29T07:03:49Z Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating LI, SAM FONG YAU NG, HOU TEE CHEMISTRY THE NATIONAL UNIVERSITY OF SINGAPORE US6660636 Granted Patent 2012-05-02T02:28:28Z 2012-05-02T02:28:28Z 2003-12-09 Patent LI, SAM FONG YAU,NG, HOU TEE (2003-12-09). Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32659 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description US6660636
author2 CHEMISTRY
author_facet CHEMISTRY
LI, SAM FONG YAU
NG, HOU TEE
format Patent
author LI, SAM FONG YAU
NG, HOU TEE
spellingShingle LI, SAM FONG YAU
NG, HOU TEE
Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
author_sort LI, SAM FONG YAU
title Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
title_short Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
title_full Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
title_fullStr Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
title_full_unstemmed Highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
title_sort highly selective and complete interconnect metal line and via/contact hole filling by electroless plating
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/32659
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