WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

EP1512173A1

Saved in:
Bibliographic Details
Main Authors: LU, HAIJING, GONG, HAO, WONG, CHEE KHUEN STEPHEN
Other Authors: MATERIALS SCIENCE
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/34871
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-34871
record_format dspace
spelling sg-nus-scholar.10635-348712015-07-29T07:20:03Z WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP LU, HAIJING GONG, HAO WONG, CHEE KHUEN STEPHEN MATERIALS SCIENCE NATIONAL UNIVERSITY OF SINGAPORE AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH EP1512173A1 Published Application 2012-10-05T06:01:42Z 2012-10-05T06:01:42Z 2005-03-09 Patent LU, HAIJING,GONG, HAO,WONG, CHEE KHUEN STEPHEN (2005-03-09). WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/34871 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description EP1512173A1
author2 MATERIALS SCIENCE
author_facet MATERIALS SCIENCE
LU, HAIJING
GONG, HAO
WONG, CHEE KHUEN STEPHEN
format Patent
author LU, HAIJING
GONG, HAO
WONG, CHEE KHUEN STEPHEN
spellingShingle LU, HAIJING
GONG, HAO
WONG, CHEE KHUEN STEPHEN
WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
author_sort LU, HAIJING
title WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_short WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_full WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_fullStr WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_full_unstemmed WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
title_sort wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/34871
_version_ 1681081550132740096

Similar Items