WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

EP1512173A1

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Bibliographic Details
Main Authors: LU, HAIJING, GONG, HAO, WONG, CHEE KHUEN STEPHEN
Other Authors: MATERIALS SCIENCE
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/34871
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Institution: National University of Singapore
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