Use of optical technique for inspection of warpage of IC packages

Use of optical technique for inspection of warpage of IC packages

10.1117/12.429546

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Bibliographic Details
Main Authors: Toh, S.L., Chau, F.S., Ong, S.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Digital speckle shearing interferometery
Electronic packages
Non-destructive testing
Optical technique
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51272
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Institution: National University of Singapore
Description
Summary:10.1117/12.429546

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