Use of optical technique for inspection of warpage of IC packages

• Main Authors: Toh, S.L., Chau, F.S., Ong, S.H.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Digital speckle shearing interferometery; Electronic packages; Non-destructive testing; Optical technique
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/51272
• Institution: National University of Singapore

10.1117/12.429546