Use of optical technique for inspection of warpage of IC packages
10.1117/12.429546
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2014
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sg-nus-scholar.10635-512722023-10-29T22:08:54Z Use of optical technique for inspection of warpage of IC packages Toh, S.L. Chau, F.S. Ong, S.H. MECHANICAL ENGINEERING ELECTRICAL & COMPUTER ENGINEERING Digital speckle shearing interferometery Electronic packages Non-destructive testing Optical technique 10.1117/12.429546 Proceedings of SPIE - The International Society for Optical Engineering 4317 610-615 PSISD 2014-04-24T08:38:20Z 2014-04-24T08:38:20Z 2001 Conference Paper Toh, S.L., Chau, F.S., Ong, S.H. (2001). Use of optical technique for inspection of warpage of IC packages. Proceedings of SPIE - The International Society for Optical Engineering 4317 : 610-615. ScholarBank@NUS Repository. https://doi.org/10.1117/12.429546 0277786X http://scholarbank.nus.edu.sg/handle/10635/51272 000171040900100 Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
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ScholarBank@NUS |
| topic |
Digital speckle shearing interferometery Electronic packages Non-destructive testing Optical technique |
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Digital speckle shearing interferometery Electronic packages Non-destructive testing Optical technique Toh, S.L. Chau, F.S. Ong, S.H. Use of optical technique for inspection of warpage of IC packages |
| description |
10.1117/12.429546 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Toh, S.L. Chau, F.S. Ong, S.H. |
| format |
Conference or Workshop Item |
| author |
Toh, S.L. Chau, F.S. Ong, S.H. |
| author_sort |
Toh, S.L. |
| title |
Use of optical technique for inspection of warpage of IC packages |
| title_short |
Use of optical technique for inspection of warpage of IC packages |
| title_full |
Use of optical technique for inspection of warpage of IC packages |
| title_fullStr |
Use of optical technique for inspection of warpage of IC packages |
| title_full_unstemmed |
Use of optical technique for inspection of warpage of IC packages |
| title_sort |
use of optical technique for inspection of warpage of ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/51272 |
| _version_ |
1781411667634028544 |