Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies

Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies

10.1557/jmr.2011.175

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Bibliographic Details
Main Authors: Chen, L., Yeap, K.B., Zeng, K.Y., She, C.M., Liu, G.R.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Adhesion
Nanoindentation
Thin film
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51441
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Institution: National University of Singapore
id sg-nus-scholar.10635-51441
record_format dspace
spelling sg-nus-scholar.10635-514412023-10-30T10:14:58Z Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies Chen, L. Yeap, K.B. Zeng, K.Y. She, C.M. Liu, G.R. MECHANICAL ENGINEERING INTERACTIVE & DIGITAL MEDIA INSTITUTE Adhesion Nanoindentation Thin film 10.1557/jmr.2011.175 Journal of Materials Research 26 19 2511-2523 JMREE 2014-04-24T09:34:34Z 2014-04-24T09:34:34Z 2011 Article Chen, L., Yeap, K.B., Zeng, K.Y., She, C.M., Liu, G.R. (2011). Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies. Journal of Materials Research 26 (19) : 2511-2523. ScholarBank@NUS Repository. https://doi.org/10.1557/jmr.2011.175 08842914 http://scholarbank.nus.edu.sg/handle/10635/51441 000296084300007 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Adhesion
Nanoindentation
Thin film
spellingShingle Adhesion
Nanoindentation
Thin film
Chen, L.
Yeap, K.B.
Zeng, K.Y.
She, C.M.
Liu, G.R.
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
description 10.1557/jmr.2011.175
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Chen, L.
Yeap, K.B.
Zeng, K.Y.
She, C.M.
Liu, G.R.
format Article
author Chen, L.
Yeap, K.B.
Zeng, K.Y.
She, C.M.
Liu, G.R.
author_sort Chen, L.
title Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
title_short Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
title_full Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
title_fullStr Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
title_full_unstemmed Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
title_sort interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - computational simulation and experimental studies
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/51441
_version_ 1781411695812411392

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