Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies
10.1557/jmr.2011.175
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Main Authors: | Chen, L., Yeap, K.B., Zeng, K.Y., She, C.M., Liu, G.R. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/51441 |
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Institution: | National University of Singapore |
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