Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system - Computational simulation and experimental studies

10.1557/jmr.2011.175

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Bibliographic Details
Main Authors: Chen, L., Yeap, K.B., Zeng, K.Y., She, C.M., Liu, G.R.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/51441
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Institution: National University of Singapore

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