Indentation crack formation and interaction on pure and metallised Si wafers

• Main Author: Su, Dan.
• Other Authors: Manoharan, Mohan
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: http://hdl.handle.net/10356/13535
• Institution: Nanyang Technological University

The metallization of Si represents an important industrial process and produces a bi-layered composite of a ductile metal film on a brittle substrate. The mechanical properties of such a composite are determined by the properties of the two layers and the interface and influenced by the fact that th...