Indentation crack formation and interaction on pure and metallised Si wafers

• 主要作者: Su, Dan.
• 其他作者: Manoharan, Mohan
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2008
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• 在線閱讀: http://hdl.handle.net/10356/13535
• 機構: Nanyang Technological University

The metallization of Si represents an important industrial process and produces a bi-layered composite of a ductile metal film on a brittle substrate. The mechanical properties of such a composite are determined by the properties of the two layers and the interface and influenced by the fact that th...