Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors:	Tay, A.A.O., Ma, Y.Y.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51575
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-51575
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spelling	sg-nus-scholar.10635-515752024-11-13T13:23:00Z Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow Tay, A.A.O. Ma, Y.Y. MECHANICAL ENGINEERING MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 1 444-450 PECCA 2014-04-24T10:15:37Z 2014-04-24T10:15:37Z 2004 Conference Paper Tay, A.A.O.,Ma, Y.Y. (2004). Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow. Proceedings - Electronic Components and Technology Conference 1 : 444-450. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/51575 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings - Electronic Components and Technology Conference
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, A.A.O. Ma, Y.Y.
format	Conference or Workshop Item
author	Tay, A.A.O. Ma, Y.Y.
spellingShingle	Tay, A.A.O. Ma, Y.Y. Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow
author_sort	Tay, A.A.O.
title	Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_short	Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_full	Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_fullStr	Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_full_unstemmed	Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow
title_sort	determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic ic packages undergoing solder reflow
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/51575
_version_	1821199794106793984

Determination of critical defect size for delamination failure of the pad/encapsulant interface of plastic IC packages undergoing solder reflow

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