Architectures and EDA for 3D FPGAs

Master's

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Bibliographic Details
Main Author:	HOU JUNSONG
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2014
Subjects:	FPGA, 3D IC, EDA, Placement, Thermal, TSV
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51956
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Institution:	National University of Singapore
Language:	English

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spelling	sg-nus-scholar.10635-519562024-10-26T02:45:05Z Architectures and EDA for 3D FPGAs HOU JUNSONG ELECTRICAL & COMPUTER ENGINEERING HA YAJUN LIU XIN FPGA, 3D IC, EDA, Placement, Thermal, TSV Master's MASTER OF ENGINEERING 2014-04-30T18:00:59Z 2014-04-30T18:00:59Z 2014-01-03 Thesis HOU JUNSONG (2014-01-03). Architectures and EDA for 3D FPGAs. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/51956 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	FPGA, 3D IC, EDA, Placement, Thermal, TSV
spellingShingle	FPGA, 3D IC, EDA, Placement, Thermal, TSV HOU JUNSONG Architectures and EDA for 3D FPGAs
description	Master's
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING HOU JUNSONG
format	Theses and Dissertations
author	HOU JUNSONG
author_sort	HOU JUNSONG
title	Architectures and EDA for 3D FPGAs
title_short	Architectures and EDA for 3D FPGAs
title_full	Architectures and EDA for 3D FPGAs
title_fullStr	Architectures and EDA for 3D FPGAs
title_full_unstemmed	Architectures and EDA for 3D FPGAs
title_sort	architectures and eda for 3d fpgas
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/51956
_version_	1821193773717127168

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