A fast algorithm for detecting die extrusion defects in IC packages

A fast algorithm for detecting die extrusion defects in IC packages

Machine Vision and Applications

Saved in:
Bibliographic Details
Main Authors: Zhou, H., Kassim, A.A., Ranganath, S.
Other Authors: ELECTRICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Die extrusion defects
Feature enhancement
IC package inspection
Linear feature extraction
Online Access:http://scholarbank.nus.edu.sg/handle/10635/54121
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:Machine Vision and Applications

Similar Items