A fast algorithm for detecting die extrusion defects in IC packages

Machine Vision and Applications

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Bibliographic Details
Main Authors:	Zhou, H., Kassim, A.A., Ranganath, S.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Die extrusion defects Feature enhancement IC package inspection Linear feature extraction
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/54121
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-54121
record_format	dspace
spelling	sg-nus-scholar.10635-541212015-02-15T23:54:24Z A fast algorithm for detecting die extrusion defects in IC packages Zhou, H. Kassim, A.A. Ranganath, S. ELECTRICAL ENGINEERING Die extrusion defects Feature enhancement IC package inspection Linear feature extraction Machine Vision and Applications 11 1-2 37-41 MVAPE 2014-06-16T09:27:29Z 2014-06-16T09:27:29Z 1998-06 Article Zhou, H.,Kassim, A.A.,Ranganath, S. (1998-06). A fast algorithm for detecting die extrusion defects in IC packages. Machine Vision and Applications 11 (1-2) : 37-41. ScholarBank@NUS Repository. 09328092 http://scholarbank.nus.edu.sg/handle/10635/54121 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Die extrusion defects Feature enhancement IC package inspection Linear feature extraction
spellingShingle	Die extrusion defects Feature enhancement IC package inspection Linear feature extraction Zhou, H. Kassim, A.A. Ranganath, S. A fast algorithm for detecting die extrusion defects in IC packages
description	Machine Vision and Applications
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING Zhou, H. Kassim, A.A. Ranganath, S.
format	Article
author	Zhou, H. Kassim, A.A. Ranganath, S.
author_sort	Zhou, H.
title	A fast algorithm for detecting die extrusion defects in IC packages
title_short	A fast algorithm for detecting die extrusion defects in IC packages
title_full	A fast algorithm for detecting die extrusion defects in IC packages
title_fullStr	A fast algorithm for detecting die extrusion defects in IC packages
title_full_unstemmed	A fast algorithm for detecting die extrusion defects in IC packages
title_sort	fast algorithm for detecting die extrusion defects in ic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/54121
_version_	1681084255854133248

A fast algorithm for detecting die extrusion defects in IC packages

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