A fast algorithm for detecting die extrusion defects in IC packages

Machine Vision and Applications

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Bibliographic Details
Main Authors:	Zhou, H., Kassim, A.A., Ranganath, S.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Die extrusion defects Feature enhancement IC package inspection Linear feature extraction
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/54121
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Institution:	National University of Singapore

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