A fast in situ approach to estimating wafer warpage profile during thermal processing in microlithography

A fast in situ approach to estimating wafer warpage profile during thermal processing in microlithography

10.1088/0957-0233/17/8/025

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Bibliographic Details
Main Authors: Hu, N., Tay, A., Tsai, K.-Y.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Fault detection
In situ estimation
Photoresist processing
Semiconductor manufacturing
Online Access:http://scholarbank.nus.edu.sg/handle/10635/54134
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/54134

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