A material removal rate model for copper abrasive-free CMP

10.1149/1.1896306

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Bibliographic Details
Main Authors:	Haque, T., Balakumar, S., Kumar, A.S., Rahman, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/54332
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-54332
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spelling	sg-nus-scholar.10635-543322023-10-26T07:57:34Z A material removal rate model for copper abrasive-free CMP Haque, T. Balakumar, S. Kumar, A.S. Rahman, M. MECHANICAL ENGINEERING 10.1149/1.1896306 Journal of the Electrochemical Society 152 6 G417-G422 JESOA 2014-06-16T09:30:00Z 2014-06-16T09:30:00Z 2005 Article Haque, T., Balakumar, S., Kumar, A.S., Rahman, M. (2005). A material removal rate model for copper abrasive-free CMP. Journal of the Electrochemical Society 152 (6) : G417-G422. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1896306 00134651 http://scholarbank.nus.edu.sg/handle/10635/54332 000229475300066 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1149/1.1896306
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Haque, T. Balakumar, S. Kumar, A.S. Rahman, M.
format	Article
author	Haque, T. Balakumar, S. Kumar, A.S. Rahman, M.
spellingShingle	Haque, T. Balakumar, S. Kumar, A.S. Rahman, M. A material removal rate model for copper abrasive-free CMP
author_sort	Haque, T.
title	A material removal rate model for copper abrasive-free CMP
title_short	A material removal rate model for copper abrasive-free CMP
title_full	A material removal rate model for copper abrasive-free CMP
title_fullStr	A material removal rate model for copper abrasive-free CMP
title_full_unstemmed	A material removal rate model for copper abrasive-free CMP
title_sort	material removal rate model for copper abrasive-free cmp
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/54332
_version_	1781411967944097792

A material removal rate model for copper abrasive-free CMP

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