An air-flow based wafer bake system for improved temperature uniformity

An air-flow based wafer bake system for improved temperature uniformity

10.1016/j.jprocont.2008.04.021

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Bibliographic Details
Main Authors: Wang, L., Loh, A.P., Gong, Z.M., Chow, S.L.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Microlithography
Post exposure bake (PEB)
Temperature uniformity
Wafer-baking process
Online Access:http://scholarbank.nus.edu.sg/handle/10635/54986
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/54986

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