A novel wafer baking system using hot air streams

A novel wafer baking system using hot air streams

10.1117/12.534753

Saved in:
Bibliographic Details
Main Authors: Lan, W., Loong, C.S., Poh, L.A., Ming, G.Z., Wan, T.W., Tay, A., Khuen, H.W.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Lithography
Post exposure bake (PEB)
Temperature uniformity
Wafer-baking process
Online Access:http://scholarbank.nus.edu.sg/handle/10635/68996
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/68996

Similar Items