A novel wafer baking system using hot air streams

• Main Authors: Lan, W., Loong, C.S., Poh, L.A., Ming, G.Z., Wan, T.W., Tay, A., Khuen, H.W.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Lithography; Post exposure bake (PEB); Temperature uniformity; Wafer-baking process
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/68996
• Institution: National University of Singapore

10.1117/12.534753