RTD response time estimation in the presence of temperature variations and its application to semiconductor manufacturing

RTD response time estimation in the presence of temperature variations and its application to semiconductor manufacturing

10.1109/TIM.2007.910097

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Bibliographic Details
Main Authors: Tan, W.W., Li, R.F.Y., Loh, A.P., Ho, W.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
In-situ temperature measurement
Loop current step response (LCSR) test
Measurement accuracy
Out-of-contact fault
Post-exposure bake (PEB)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/57322
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/57322

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