A three-dimensional modeling of wire sweep incorporating resin cure

A three-dimensional modeling of wire sweep incorporating resin cure

10.1109/96.659508

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Bibliographic Details
Main Authors: Wu, J.H., Tay, A.A.O., Yeo, K.S., Lim, T.B.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Subjects:
3-D modeling
Resin cure
Transfer molding
Wire sweep
Online Access:http://scholarbank.nus.edu.sg/handle/10635/57854
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/57854

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