A three-dimensional modeling of wire sweep incorporating resin cure

10.1109/96.659508

Saved in:

Bibliographic Details
Main Authors:	Wu, J.H., Tay, A.A.O., Yeo, K.S., Lim, T.B.
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Article
Published:	2014
Subjects:	3-D modeling Resin cure Transfer molding Wire sweep
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/57854
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-57854
record_format	dspace
spelling	sg-nus-scholar.10635-578542023-10-27T07:43:20Z A three-dimensional modeling of wire sweep incorporating resin cure Wu, J.H. Tay, A.A.O. Yeo, K.S. Lim, T.B. MECHANICAL & PRODUCTION ENGINEERING 3-D modeling Resin cure Transfer molding Wire sweep 10.1109/96.659508 IEEE Transactions on Components Packaging and Manufacturing Technology Part B 21 1 65-72 2014-06-17T05:08:06Z 2014-06-17T05:08:06Z 1998-02 Article Wu, J.H., Tay, A.A.O., Yeo, K.S., Lim, T.B. (1998-02). A three-dimensional modeling of wire sweep incorporating resin cure. IEEE Transactions on Components Packaging and Manufacturing Technology Part B 21 (1) : 65-72. ScholarBank@NUS Repository. https://doi.org/10.1109/96.659508 10709894 http://scholarbank.nus.edu.sg/handle/10635/57854 000072077300010 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	3-D modeling Resin cure Transfer molding Wire sweep
spellingShingle	3-D modeling Resin cure Transfer molding Wire sweep Wu, J.H. Tay, A.A.O. Yeo, K.S. Lim, T.B. A three-dimensional modeling of wire sweep incorporating resin cure
description	10.1109/96.659508
author2	MECHANICAL & PRODUCTION ENGINEERING
author_facet	MECHANICAL & PRODUCTION ENGINEERING Wu, J.H. Tay, A.A.O. Yeo, K.S. Lim, T.B.
format	Article
author	Wu, J.H. Tay, A.A.O. Yeo, K.S. Lim, T.B.
author_sort	Wu, J.H.
title	A three-dimensional modeling of wire sweep incorporating resin cure
title_short	A three-dimensional modeling of wire sweep incorporating resin cure
title_full	A three-dimensional modeling of wire sweep incorporating resin cure
title_fullStr	A three-dimensional modeling of wire sweep incorporating resin cure
title_full_unstemmed	A three-dimensional modeling of wire sweep incorporating resin cure
title_sort	three-dimensional modeling of wire sweep incorporating resin cure
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/57854
_version_	1781781486742011904

A three-dimensional modeling of wire sweep incorporating resin cure

Similar Items