Effects of moisture and delamination on cracking of plastic IC packages during solder reflow
Proceedings - Electronic Components and Technology Conference
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2014
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sg-nus-scholar.10635-582292024-11-13T13:22:54Z Effects of moisture and delamination on cracking of plastic IC packages during solder reflow Tay, A.A.O. Lin, T.Y. MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 777-782 PECCA 2014-06-17T05:12:15Z 2014-06-17T05:12:15Z 1996 Article Tay, A.A.O.,Lin, T.Y. (1996). Effects of moisture and delamination on cracking of plastic IC packages during solder reflow. Proceedings - Electronic Components and Technology Conference : 777-782. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/58229 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Proceedings - Electronic Components and Technology Conference |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Lin, T.Y. |
| format |
Article |
| author |
Tay, A.A.O. Lin, T.Y. |
| spellingShingle |
Tay, A.A.O. Lin, T.Y. Effects of moisture and delamination on cracking of plastic IC packages during solder reflow |
| author_sort |
Tay, A.A.O. |
| title |
Effects of moisture and delamination on cracking of plastic IC packages during solder reflow |
| title_short |
Effects of moisture and delamination on cracking of plastic IC packages during solder reflow |
| title_full |
Effects of moisture and delamination on cracking of plastic IC packages during solder reflow |
| title_fullStr |
Effects of moisture and delamination on cracking of plastic IC packages during solder reflow |
| title_full_unstemmed |
Effects of moisture and delamination on cracking of plastic IC packages during solder reflow |
| title_sort |
effects of moisture and delamination on cracking of plastic ic packages during solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/58229 |
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1821197446109200384 |