Impact of moisture diffusion during solder reflow on package reliability
Proceedings - Electronic Components and Technology Conference
Saved in:
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/58371 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-58371 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-583712024-11-13T13:23:11Z Impact of moisture diffusion during solder reflow on package reliability Tay, A.A.O. Lin, T.Y. MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 830-836 PECCA 2014-06-17T05:13:48Z 2014-06-17T05:13:48Z 1999 Article Tay, A.A.O.,Lin, T.Y. (1999). Impact of moisture diffusion during solder reflow on package reliability. Proceedings - Electronic Components and Technology Conference : 830-836. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/58371 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Proceedings - Electronic Components and Technology Conference |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Lin, T.Y. |
| format |
Article |
| author |
Tay, A.A.O. Lin, T.Y. |
| spellingShingle |
Tay, A.A.O. Lin, T.Y. Impact of moisture diffusion during solder reflow on package reliability |
| author_sort |
Tay, A.A.O. |
| title |
Impact of moisture diffusion during solder reflow on package reliability |
| title_short |
Impact of moisture diffusion during solder reflow on package reliability |
| title_full |
Impact of moisture diffusion during solder reflow on package reliability |
| title_fullStr |
Impact of moisture diffusion during solder reflow on package reliability |
| title_full_unstemmed |
Impact of moisture diffusion during solder reflow on package reliability |
| title_sort |
impact of moisture diffusion during solder reflow on package reliability |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/58371 |
| _version_ |
1821231634313117696 |