Analytical solutions for PCB assembly subjected to mismatched thermal expansion

Analytical solutions for PCB assembly subjected to mismatched thermal expansion

10.1109/TADVP.2009.2025222

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Bibliographic Details
Main Authors: Wong, E.H., Lim, K.M., Mai, Y.-W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Analytical solutions
Electronics packaging
Solder joints
Thermal stress
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59538
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Institution: National University of Singapore
id sg-nus-scholar.10635-59538
record_format dspace
spelling sg-nus-scholar.10635-595382024-11-08T17:45:21Z Analytical solutions for PCB assembly subjected to mismatched thermal expansion Wong, E.H. Lim, K.M. Mai, Y.-W. MECHANICAL ENGINEERING Analytical solutions Electronics packaging Solder joints Thermal stress 10.1109/TADVP.2009.2025222 IEEE Transactions on Advanced Packaging 32 3 602-611 ITAPF 2014-06-17T06:12:38Z 2014-06-17T06:12:38Z 2009 Article Wong, E.H., Lim, K.M., Mai, Y.-W. (2009). Analytical solutions for PCB assembly subjected to mismatched thermal expansion. IEEE Transactions on Advanced Packaging 32 (3) : 602-611. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2009.2025222 15213323 http://scholarbank.nus.edu.sg/handle/10635/59538 000268757000004 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Analytical solutions
Electronics packaging
Solder joints
Thermal stress
spellingShingle Analytical solutions
Electronics packaging
Solder joints
Thermal stress
Wong, E.H.
Lim, K.M.
Mai, Y.-W.
Analytical solutions for PCB assembly subjected to mismatched thermal expansion
description 10.1109/TADVP.2009.2025222
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Wong, E.H.
Lim, K.M.
Mai, Y.-W.
format Article
author Wong, E.H.
Lim, K.M.
Mai, Y.-W.
author_sort Wong, E.H.
title Analytical solutions for PCB assembly subjected to mismatched thermal expansion
title_short Analytical solutions for PCB assembly subjected to mismatched thermal expansion
title_full Analytical solutions for PCB assembly subjected to mismatched thermal expansion
title_fullStr Analytical solutions for PCB assembly subjected to mismatched thermal expansion
title_full_unstemmed Analytical solutions for PCB assembly subjected to mismatched thermal expansion
title_sort analytical solutions for pcb assembly subjected to mismatched thermal expansion
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/59538
_version_ 1821223879286194176

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