Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates

10.1007/s11664-009-0925-x

Saved in:

Bibliographic Details
Main Authors:	Alam, M.E., Nai, S.M.L., Gupta, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Aging Intermetallic compound thickness Sn-Cu solder
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60028
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-60028
record_format	dspace
spelling	sg-nus-scholar.10635-600282023-10-25T20:02:56Z Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates Alam, M.E. Nai, S.M.L. Gupta, M. MECHANICAL ENGINEERING Aging Intermetallic compound thickness Sn-Cu solder 10.1007/s11664-009-0925-x Journal of Electronic Materials 38 12 2479-2488 JECMA 2014-06-17T06:18:24Z 2014-06-17T06:18:24Z 2009-12 Article Alam, M.E., Nai, S.M.L., Gupta, M. (2009-12). Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates. Journal of Electronic Materials 38 (12) : 2479-2488. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-009-0925-x 03615235 http://scholarbank.nus.edu.sg/handle/10635/60028 000272301900009 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Aging Intermetallic compound thickness Sn-Cu solder
spellingShingle	Aging Intermetallic compound thickness Sn-Cu solder Alam, M.E. Nai, S.M.L. Gupta, M. Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
description	10.1007/s11664-009-0925-x
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Alam, M.E. Nai, S.M.L. Gupta, M.
format	Article
author	Alam, M.E. Nai, S.M.L. Gupta, M.
author_sort	Alam, M.E.
title	Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
title_short	Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
title_full	Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
title_fullStr	Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
title_full_unstemmed	Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
title_sort	effect of amount of cu on the intermetallic layer thickness between sn-cu solders and cu substrates
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60028
_version_	1781781752485773312

Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates

Similar Items