Numerical simulation of delamination in IC packages using a new variable-order singular boundary element

10.1115/1.1604803

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Bibliographic Details
Main Authors:	Tay, A.A.O., Lee, K.H., Lim, K.M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60942
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60942
record_format	dspace
spelling	sg-nus-scholar.10635-609422024-11-13T13:22:58Z Numerical simulation of delamination in IC packages using a new variable-order singular boundary element Tay, A.A.O. Lee, K.H. Lim, K.M. MECHANICAL ENGINEERING 10.1115/1.1604803 Journal of Electronic Packaging, Transactions of the ASME 125 4 569-575 JEPAE 2014-06-17T06:29:08Z 2014-06-17T06:29:08Z 2003-12 Article Tay, A.A.O., Lee, K.H., Lim, K.M. (2003-12). Numerical simulation of delamination in IC packages using a new variable-order singular boundary element. Journal of Electronic Packaging, Transactions of the ASME 125 (4) : 569-575. ScholarBank@NUS Repository. https://doi.org/10.1115/1.1604803 10437398 http://scholarbank.nus.edu.sg/handle/10635/60942 000187619700017 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1115/1.1604803
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, A.A.O. Lee, K.H. Lim, K.M.
format	Article
author	Tay, A.A.O. Lee, K.H. Lim, K.M.
spellingShingle	Tay, A.A.O. Lee, K.H. Lim, K.M. Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
author_sort	Tay, A.A.O.
title	Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
title_short	Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
title_full	Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
title_fullStr	Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
title_full_unstemmed	Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
title_sort	numerical simulation of delamination in ic packages using a new variable-order singular boundary element
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60942
_version_	1821198008486723584

Numerical simulation of delamination in IC packages using a new variable-order singular boundary element

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