Numerical simulation of delamination in IC packages using a new variable-order singular boundary element
10.1115/1.1604803
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sg-nus-scholar.10635-609422024-11-13T13:22:58Z Numerical simulation of delamination in IC packages using a new variable-order singular boundary element Tay, A.A.O. Lee, K.H. Lim, K.M. MECHANICAL ENGINEERING 10.1115/1.1604803 Journal of Electronic Packaging, Transactions of the ASME 125 4 569-575 JEPAE 2014-06-17T06:29:08Z 2014-06-17T06:29:08Z 2003-12 Article Tay, A.A.O., Lee, K.H., Lim, K.M. (2003-12). Numerical simulation of delamination in IC packages using a new variable-order singular boundary element. Journal of Electronic Packaging, Transactions of the ASME 125 (4) : 569-575. ScholarBank@NUS Repository. https://doi.org/10.1115/1.1604803 10437398 http://scholarbank.nus.edu.sg/handle/10635/60942 000187619700017 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1115/1.1604803 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Lee, K.H. Lim, K.M. |
| format |
Article |
| author |
Tay, A.A.O. Lee, K.H. Lim, K.M. |
| spellingShingle |
Tay, A.A.O. Lee, K.H. Lim, K.M. Numerical simulation of delamination in IC packages using a new variable-order singular boundary element |
| author_sort |
Tay, A.A.O. |
| title |
Numerical simulation of delamination in IC packages using a new variable-order singular boundary element |
| title_short |
Numerical simulation of delamination in IC packages using a new variable-order singular boundary element |
| title_full |
Numerical simulation of delamination in IC packages using a new variable-order singular boundary element |
| title_fullStr |
Numerical simulation of delamination in IC packages using a new variable-order singular boundary element |
| title_full_unstemmed |
Numerical simulation of delamination in IC packages using a new variable-order singular boundary element |
| title_sort |
numerical simulation of delamination in ic packages using a new variable-order singular boundary element |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/60942 |
| _version_ |
1821198008486723584 |