Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

10.1016/j.ijheatmasstransfer.2006.02.047

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Bibliographic Details
Main Authors: Chakraborty, A., Saha, B.B., Koyama, S., Ng, K.C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61559
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Institution: National University of Singapore
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Summary:10.1016/j.ijheatmasstransfer.2006.02.047

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