Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis
10.1016/j.ijheatmasstransfer.2006.02.047
Saved in:
Main Authors: | Chakraborty, A., Saha, B.B., Koyama, S., Ng, K.C. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/61559 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Thin-film thermoelectric cooler: Thermodynamic modelling and its temperature-entropy flux formulation
by: Chakraborty, A., et al.
Published: (2014) -
On thermodynamics of advanced adsorption cooling devices
by: Saha, B.B., et al.
Published: (2014) -
Thermodynamic formalism of minimum heat source temperature for driving advanced adsorption cooling device
by: Saha, B.B., et al.
Published: (2014) -
Thermoelectric cooling devices: thermodynamic modelling and their application in adsorption cooling cycles
by: ANUTOSH CHAKRABORTY
Published: (2010) -
Temperature-entropy formulation of thermoelectric thermodynamic cycles
by: Chua, H.T., et al.
Published: (2014)