Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

10.1016/j.ijheatmasstransfer.2006.02.047

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書目詳細資料
Main Authors:	Chakraborty, A., Saha, B.B., Koyama, S., Ng, K.C.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/61559
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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