A stereo vision system for the inspection of IC bonding wires
10.1002/ima.1010
Saved in:
Main Authors: | Ye, Q.Z., Ong, S.H., Han, X. |
---|---|
Other Authors: | ELECTRICAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/61718 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
3D visual inspection of IC bonding wires
by: Ong, S.H., et al.
Published: (2014) -
Geometric modelling of IC die bonds for inspection
by: Ngan, K.N., et al.
Published: (2014) -
3D image reconstruction based on current stereo vision techniques
by: Teo, Jun Wei
Published: (2024) -
A development of artificial neural system for the interpretation of the outputs of machine vision wire bonding (third optical) inspection
by: Co, Celso B.
Published: (1996) -
Photometric stereo and appearance capture
by: ZHOU ZHENGLONG
Published: (2014)