Neural network modeling with confidence bounds: A case study on the solder paste deposition process
10.1109/6104.980042
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sg-nus-scholar.10635-632032023-10-26T20:41:12Z Neural network modeling with confidence bounds: A case study on the solder paste deposition process Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. INDUSTRIAL & SYSTEMS ENGINEERING Modeling and forecasting Neural networks Nonlinear regression Prediction intervals Process control Solder paste deposition 10.1109/6104.980042 IEEE Transactions on Electronics Packaging Manufacturing 24 4 323-332 ITEPF 2014-06-17T07:01:22Z 2014-06-17T07:01:22Z 2001-10 Article Ho, S.L., Xie, M., Tang, L.C., Xu, K., Goh, T.N. (2001-10). Neural network modeling with confidence bounds: A case study on the solder paste deposition process. IEEE Transactions on Electronics Packaging Manufacturing 24 (4) : 323-332. ScholarBank@NUS Repository. https://doi.org/10.1109/6104.980042 1521334X http://scholarbank.nus.edu.sg/handle/10635/63203 000173531700014 Scopus |
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Modeling and forecasting Neural networks Nonlinear regression Prediction intervals Process control Solder paste deposition |
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Modeling and forecasting Neural networks Nonlinear regression Prediction intervals Process control Solder paste deposition Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
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10.1109/6104.980042 |
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INDUSTRIAL & SYSTEMS ENGINEERING |
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INDUSTRIAL & SYSTEMS ENGINEERING Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. |
format |
Article |
author |
Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. |
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Ho, S.L. |
title |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
title_short |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
title_full |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
title_fullStr |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
title_full_unstemmed |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
title_sort |
neural network modeling with confidence bounds: a case study on the solder paste deposition process |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/63203 |
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1781782203626160128 |