Thickness dependent thermal rearrangement of an ortho-functional polyimide

Thickness dependent thermal rearrangement of an ortho-functional polyimide

Journal of Membrane Science

Saved in:
Bibliographic Details
Main Authors: Wang, H., Chung, T.-S., Paul, D.R.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Subjects:
Diffusional resistance
Polymer segmental mobility
Thermal rearrangement
Thickness dependence
Online Access:http://scholarbank.nus.edu.sg/handle/10635/64734
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:Journal of Membrane Science

Similar Items