Thickness dependent thermal rearrangement of an ortho-functional polyimide

Thickness dependent thermal rearrangement of an ortho-functional polyimide

Journal of Membrane Science

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Bibliographic Details
Main Authors: Wang, H., Chung, T.-S., Paul, D.R.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Subjects:
Diffusional resistance
Polymer segmental mobility
Thermal rearrangement
Thickness dependence
Online Access:http://scholarbank.nus.edu.sg/handle/10635/64734
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/64734

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