Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

Journal of Electronic Packaging, Transactions of the ASME

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Bibliographic Details
Main Authors: Zhang, J., Cui, C.Q., Lim, T.B., Kang, E.T.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/66825
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-668252015-03-27T07:12:35Z Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB) Zhang, J. Cui, C.Q. Lim, T.B. Kang, E.T. CHEMICAL & ENVIRONMENTAL ENGINEERING Journal of Electronic Packaging, Transactions of the ASME 121 4 291-296 JEPAE 2014-06-17T08:34:53Z 2014-06-17T08:34:53Z 1999-12 Article Zhang, J.,Cui, C.Q.,Lim, T.B.,Kang, E.T. (1999-12). Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB). Journal of Electronic Packaging, Transactions of the ASME 121 (4) : 291-296. ScholarBank@NUS Repository. 10437398 http://scholarbank.nus.edu.sg/handle/10635/66825 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Journal of Electronic Packaging, Transactions of the ASME
author2 CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet CHEMICAL & ENVIRONMENTAL ENGINEERING
Zhang, J.
Cui, C.Q.
Lim, T.B.
Kang, E.T.
format Article
author Zhang, J.
Cui, C.Q.
Lim, T.B.
Kang, E.T.
spellingShingle Zhang, J.
Cui, C.Q.
Lim, T.B.
Kang, E.T.
Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
author_sort Zhang, J.
title Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
title_short Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
title_full Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
title_fullStr Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
title_full_unstemmed Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
title_sort surface graft copolymerization enhanced lamination of poly(tetrafluoroethylene) film to copper and epoxy-based print circuit board (pcb)
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/66825
_version_ 1681086543393980416

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