Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

• Main Authors: Zhang, J., Cui, C.Q., Lim, T.B., Kang, E.T.
• Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
• Format: Article
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/66825
• Institution: National University of Singapore

Journal of Electronic Packaging, Transactions of the ASME