Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization

10.1016/0025-5408(96)00127-4

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Bibliographic Details
Main Authors:	Wang, T., Kang, E.T., Neoh, K.G., Tan, K.L., Cui, C.Q., Chakravorty, K.K., Lim, T.B.
Other Authors:	CHEMICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	A. electronic materials A. interfaces C. photoelectron spectroscopy D. mechanical properties
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/67493
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Institution:	National University of Singapore

Description
Summary:	10.1016/0025-5408(96)00127-4

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