Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization
10.1016/0025-5408(96)00127-4
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Main Authors: | Wang, T., Kang, E.T., Neoh, K.G., Tan, K.L., Cui, C.Q., Chakravorty, K.K., Lim, T.B. |
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Other Authors: | INSTITUTE OF MICROELECTRONICS |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/67493 |
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Institution: | National University of Singapore |
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