Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization

• Main Authors: Wang, T., Kang, E.T., Neoh, K.G., Tan, K.L., Cui, C.Q., Chakravorty, K.K., Lim, T.B.
• Other Authors: CHEMICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: A. electronic materials; A. interfaces; C. photoelectron spectroscopy; D. mechanical properties
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/67493
• Institution: National University of Singapore

10.1016/0025-5408(96)00127-4