An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages

• Main Authors: Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/69304
• Institution: National University of Singapore

10.1109/EPEP.2007.4387177