Improved comprehensive thermal model for power electronics building block applications
10.1109/APEC.2011.5744626
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Main Authors: | Wang, H., Khambadkone, A.M., Erik, B.K. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/70550 |
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Institution: | National University of Singapore |
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