Improved comprehensive thermal model for power electronics building block applications

10.1109/APEC.2011.5744626

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Bibliographic Details
Main Authors: Wang, H., Khambadkone, A.M., Erik, B.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/70550
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Institution: National University of Singapore

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