Modeling of advanced multilayered packages with multiple vias and finite ground planes

Modeling of advanced multilayered packages with multiple vias and finite ground planes

10.1109/EPEP.2007.4387180

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Bibliographic Details
Main Authors: Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P., Li, L.-W.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70992
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Institution: National University of Singapore
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Summary:10.1109/EPEP.2007.4387180

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