Modeling of advanced multilayered packages with multiple vias and finite ground planes

10.1109/EPEP.2007.4387180

Saved in:

Bibliographic Details
Main Authors:	Liu, E.-X., Wei, X., Oo, Z.Z., Li, E.-P., Li, L.-W.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/70992
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-70992
record_format	dspace
spelling	sg-nus-scholar.10635-709922015-06-17T18:39:44Z Modeling of advanced multilayered packages with multiple vias and finite ground planes Liu, E.-X. Wei, X. Oo, Z.Z. Li, E.-P. Li, L.-W. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EPEP.2007.4387180 IEEE Topical Meeting on Electrical Performance of Electronic Packaging 275-278 2014-06-19T03:18:37Z 2014-06-19T03:18:37Z 2007 Conference Paper Liu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P.,Li, L.-W. (2007). Modeling of advanced multilayered packages with multiple vias and finite ground planes. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 275-278. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPEP.2007.4387180" target="_blank">https://doi.org/10.1109/EPEP.2007.4387180</a> 1424408830 http://scholarbank.nus.edu.sg/handle/10635/70992 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/EPEP.2007.4387180
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Liu, E.-X. Wei, X. Oo, Z.Z. Li, E.-P. Li, L.-W.
format	Conference or Workshop Item
author	Liu, E.-X. Wei, X. Oo, Z.Z. Li, E.-P. Li, L.-W.
spellingShingle	Liu, E.-X. Wei, X. Oo, Z.Z. Li, E.-P. Li, L.-W. Modeling of advanced multilayered packages with multiple vias and finite ground planes
author_sort	Liu, E.-X.
title	Modeling of advanced multilayered packages with multiple vias and finite ground planes
title_short	Modeling of advanced multilayered packages with multiple vias and finite ground planes
title_full	Modeling of advanced multilayered packages with multiple vias and finite ground planes
title_fullStr	Modeling of advanced multilayered packages with multiple vias and finite ground planes
title_full_unstemmed	Modeling of advanced multilayered packages with multiple vias and finite ground planes
title_sort	modeling of advanced multilayered packages with multiple vias and finite ground planes
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/70992
_version_	1681087302043959296

Modeling of advanced multilayered packages with multiple vias and finite ground planes

Similar Items