Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect

10.1109/ISEMC.2011.6038339

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Bibliographic Details
Main Authors: Zhao, W.-S., Guo, Y.-X., Yin, W.-Y.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72075
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-720752015-02-04T05:34:51Z Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. ELECTRICAL & COMPUTER ENGINEERING 10.1109/ISEMC.2011.6038339 IEEE International Symposium on Electromagnetic Compatibility 373-378 IISPD 2014-06-19T03:31:09Z 2014-06-19T03:31:09Z 2011 Conference Paper Zhao, W.-S.,Guo, Y.-X.,Yin, W.-Y. (2011). Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect. IEEE International Symposium on Electromagnetic Compatibility : 373-378. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ISEMC.2011.6038339" target="_blank">https://doi.org/10.1109/ISEMC.2011.6038339</a> 9781424447831 10774076 http://scholarbank.nus.edu.sg/handle/10635/72075 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 10.1109/ISEMC.2011.6038339
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Zhao, W.-S.
Guo, Y.-X.
Yin, W.-Y.
format Conference or Workshop Item
author Zhao, W.-S.
Guo, Y.-X.
Yin, W.-Y.
spellingShingle Zhao, W.-S.
Guo, Y.-X.
Yin, W.-Y.
Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
author_sort Zhao, W.-S.
title Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
title_short Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
title_full Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
title_fullStr Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
title_full_unstemmed Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
title_sort transmission characteristics of a coaxial through-silicon via (c-tsv) interconnect
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/72075
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