Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect
10.1109/ISEMC.2011.6038339
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sg-nus-scholar.10635-720752015-02-04T05:34:51Z Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. ELECTRICAL & COMPUTER ENGINEERING 10.1109/ISEMC.2011.6038339 IEEE International Symposium on Electromagnetic Compatibility 373-378 IISPD 2014-06-19T03:31:09Z 2014-06-19T03:31:09Z 2011 Conference Paper Zhao, W.-S.,Guo, Y.-X.,Yin, W.-Y. (2011). Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect. IEEE International Symposium on Electromagnetic Compatibility : 373-378. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ISEMC.2011.6038339" target="_blank">https://doi.org/10.1109/ISEMC.2011.6038339</a> 9781424447831 10774076 http://scholarbank.nus.edu.sg/handle/10635/72075 NOT_IN_WOS Scopus |
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10.1109/ISEMC.2011.6038339 |
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ELECTRICAL & COMPUTER ENGINEERING |
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ELECTRICAL & COMPUTER ENGINEERING Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. |
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Conference or Workshop Item |
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Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. |
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Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect |
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Zhao, W.-S. |
title |
Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect |
title_short |
Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect |
title_full |
Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect |
title_fullStr |
Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect |
title_full_unstemmed |
Transmission characteristics of a coaxial through-silicon via (C-TSV) interconnect |
title_sort |
transmission characteristics of a coaxial through-silicon via (c-tsv) interconnect |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/72075 |
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1681087499568414720 |