Vacuum based wafer level encapsulation (WLE) of MEMS using physical vapor deposition (PVD)

Vacuum based wafer level encapsulation (WLE) of MEMS using physical vapor deposition (PVD)

10.1109/EPTC.2012.6507104

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Bibliographic Details
Main Authors: Soon, B.W., Singh, N., Tsai, J.M., Lee, C.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72146
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/72146

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