IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.

1850-1851

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Bibliographic Details
Main Authors: Ngan, King N., Kang, Sing B.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72680
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Institution: National University of Singapore
id sg-nus-scholar.10635-72680
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spelling sg-nus-scholar.10635-726802015-01-09T04:03:05Z IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION. Ngan, King N. Kang, Sing B. ELECTRICAL ENGINEERING 1850-1851 2014-06-19T05:10:48Z 2014-06-19T05:10:48Z 1988 Conference Paper Ngan, King N.,Kang, Sing B. (1988). IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION. : 1850-1851. ScholarBank@NUS Repository. 0818608528 http://scholarbank.nus.edu.sg/handle/10635/72680 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 1850-1851
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Ngan, King N.
Kang, Sing B.
format Conference or Workshop Item
author Ngan, King N.
Kang, Sing B.
spellingShingle Ngan, King N.
Kang, Sing B.
IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
author_sort Ngan, King N.
title IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
title_short IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
title_full IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
title_fullStr IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
title_full_unstemmed IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
title_sort ic wire bond inspection using elliptical model approximation.
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/72680
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